Amkor Technology Total Liabilities 2010-2025 | AMKR

Amkor Technology total liabilities from 2010 to 2025. Total liabilities can be defined as the total value of all possible claims against the corporation.
Amkor Technology Annual Total Liabilities
(Millions of US $)
2024 $2,761
2023 $2,776
2022 $3,122
2021 $3,066
2020 $2,668
2019 $2,705
2018 $2,640
2017 $2,789
2016 $2,689
2015 $2,809
2014 $2,504
2013 $2,462
2012 $2,358
2011 $2,072
2010 $2,100
2009 $2,043
Amkor Technology Quarterly Total Liabilities
(Millions of US $)
2025-03-31 $2,731
2024-12-31 $2,761
2024-09-30 $2,832
2024-06-30 $2,782
2024-03-31 $2,654
2023-12-31 $2,776
2023-09-30 $2,857
2023-06-30 $2,875
2023-03-31 $2,855
2022-12-31 $3,122
2022-09-30 $3,175
2022-06-30 $3,163
2022-03-31 $3,099
2021-12-31 $3,066
2021-09-30 $3,011
2021-06-30 $2,985
2021-03-31 $2,591
2020-12-31 $2,668
2020-09-30 $2,914
2020-06-30 $2,998
2020-03-31 $2,753
2019-12-31 $2,705
2019-09-30 $2,518
2019-06-30 $2,478
2019-03-31 $3,015
2018-12-31 $2,640
2018-09-30 $2,674
2018-06-30 $2,612
2018-03-31 $2,645
2017-12-31 $2,789
2017-09-30 $2,829
2017-06-30 $2,857
2017-03-31 $2,769
2016-12-31 $2,689
2016-09-30 $2,901
2016-06-30 $2,851
2016-03-31 $2,714
2015-12-31 $2,809
2015-09-30 $2,444
2015-06-30 $2,475
2015-03-31 $2,470
2014-12-31 $2,504
2014-09-30 $2,629
2014-06-30 $2,518
2014-03-31 $2,512
2013-12-31 $2,462
2013-09-30 $2,548
2013-06-30 $2,516
2013-03-31 $2,398
2012-12-31 $2,358
2012-09-30 $2,484
2012-06-30 $2,168
2012-03-31 $2,097
2011-12-31 $2,072
2011-09-30 $2,126
2011-06-30 $2,036
2011-03-31 $1,937
2010-12-31 $2,100
2010-09-30 $2,241
2010-06-30 $2,196
2010-03-31 $2,081
2009-12-31 $2,043
2009-09-30 $2,119
2009-06-30 $2,082
2009-03-31 $1,926
Sector Industry Market Cap Revenue
Computer and Technology ELEC COMP-SEMIC $4.482B $6.318B
Amkor is the world's largest independent provider of semiconductorpackaging and test services. Also, the company is one of the leadingdevelopers of advanced semiconductor packaging and test technology. The company offers one of the industry's broadest integrated sets of packaging and test services, which are the final procedures necessary to prepare semiconductor devices for further use. Its customers outsource the packaging and testing of semiconductor chips to the company in order to benefit from the our expertise in the development and implementation.
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