KLA Pre-Paid Expenses 2010-2024 | KLAC

KLA pre-paid expenses from 2010 to 2024. Pre-paid expenses can be defined as a current asset created by prepayment of costs and expenses for which the benefits will occur at a future date.
  • KLA pre-paid expenses for the quarter ending June 30, 2024 were $M, a NAN% increase year-over-year.
  • KLA pre-paid expenses for 2024 were $0B, a NAN% decline from 2023.
  • KLA pre-paid expenses for 2023 were $0B, a NAN% decline from 2022.
  • KLA pre-paid expenses for 2022 were $0B, a NAN% decline from 2021.
KLA Annual Pre-Paid Expenses
(Millions of US $)
2024 $
2023 $
2022 $
2021 $
2020 $
2019 $
2018 $
2017 $
2016 $
2015 $
2014 $
2013 $
2012 $
2011 $
2010 $
2009 $
KLA Quarterly Pre-Paid Expenses
(Millions of US $)
2024-06-30
2024-03-31
2023-12-31
2023-09-30
2023-06-30
2023-03-31
2022-12-31
2022-09-30
2022-06-30
2022-03-31
2021-12-31
2021-09-30
2021-06-30
2021-03-31
2020-12-31
2020-09-30
2020-06-30
2020-03-31
2019-12-31
2019-09-30
2019-06-30
2019-03-31
2018-12-31
2018-09-30
2018-06-30
2018-03-31
2017-12-31
2017-09-30
2017-06-30
2017-03-31
2016-12-31
2016-09-30
2016-06-30
2016-03-31
2015-12-31
2015-09-30
2015-06-30
2015-03-31
2014-12-31
2014-09-30
2014-06-30
2014-03-31
2013-12-31
2013-09-30
2013-06-30
2013-03-31
2012-12-31
2012-09-30
2012-06-30
2012-03-31
2011-12-31
2011-09-30
2011-06-30
2011-03-31
2010-12-31
2010-09-30
2010-06-30
2010-03-31
2009-12-31
2009-09-30
2009-06-30
2009-03-31
Sector Industry Market Cap Revenue
Computer and Technology Electrical Products - Miscellaneous $98.427B $9.812B
KLA Corporation is an original equipment manufacturer (OEM) of process diagnostics and control (PDC) equipment and yield management solutions required for the fabrication of semiconductor integrated circuits (ICs) or chips. The company has a comprehensive portfolio of products addressing each major PDC subsegment'photomask (reticle) inspection, wafer inspection/defect review and metrology.Reticle production is vital to the semiconductor device formation process. Reticles are used to control the precise deposition of materials onto the wafer, which ultimately change its chemical characteristics, imparting specific functionalities to the ICs thus created. Inspection and metrology tools measure the quality of the reticles, helping to improve reticle production yields. As a result of the broader applicability of semiconductors, shrinking form factors and increasing functionalities of individual chips, reticle design and production are growing in importance.
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