Camtek Long-Term Investments 2010-2024 | CAMT
Camtek long-term investments from 2010 to 2024. Long-term investments can be defined as the aggregate value of debt and or equity investments with maturities or benefits lasting more than one year.
Camtek Annual Long-Term Investments
(Millions of US $) |
| 2023 |
$74 |
| 2022 |
$ |
| 2021 |
$ |
| 2020 |
$ |
| 2019 |
$ |
| 2018 |
$ |
| 2017 |
$ |
| 2016 |
$ |
| 2015 |
$ |
| 2014 |
$ |
| 2013 |
$ |
| 2012 |
$ |
| 2011 |
$ |
| 2010 |
$ |
| 2009 |
$ |
Camtek Quarterly Long-Term Investments
(Millions of US $) |
| 2024-09-30 |
$83 |
| 2024-06-30 |
$82 |
| 2024-03-31 |
$84 |
| 2023-12-31 |
$74 |
| 2023-09-30 |
$73 |
| 2023-06-30 |
|
| 2023-03-31 |
|
| 2022-12-31 |
|
| 2022-09-30 |
|
| 2022-06-30 |
|
| 2022-03-31 |
|
| 2021-12-31 |
|
| 2021-09-30 |
|
| 2021-06-30 |
|
| 2021-03-31 |
|
| 2020-12-31 |
|
| 2020-09-30 |
|
| 2020-06-30 |
|
| 2020-03-31 |
|
| 2019-12-31 |
|
| 2019-09-30 |
|
| 2019-06-30 |
|
| 2019-03-31 |
|
| 2018-12-31 |
|
| 2018-09-30 |
|
| 2018-06-30 |
|
| 2018-03-31 |
|
| 2017-12-31 |
|
| 2017-09-30 |
|
| 2017-06-30 |
|
| 2017-03-31 |
|
| 2016-12-31 |
|
| 2016-09-30 |
|
| 2016-06-30 |
|
| 2016-03-31 |
|
| 2015-12-31 |
|
| 2015-09-30 |
|
| 2015-06-30 |
|
| 2015-03-31 |
|
| 2014-12-31 |
|
| 2014-09-30 |
|
| 2014-06-30 |
|
| 2014-03-31 |
|
| 2013-12-31 |
|
| 2013-09-30 |
|
| 2013-06-30 |
|
| 2013-03-31 |
|
| 2012-12-31 |
|
| 2012-09-30 |
|
| 2012-06-30 |
|
| 2012-03-31 |
|
| 2011-12-31 |
|
| 2011-09-30 |
|
| 2011-06-30 |
|
| 2011-03-31 |
|
| 2010-12-31 |
|
| 2010-09-30 |
|
| 2010-06-30 |
|
| 2010-03-31 |
|
| 2009-12-31 |
|
| 2009-09-30 |
|
| 2009-06-30 |
|
| 2009-03-31 |
|
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Electrical Measuring Instruments |
$3.845B |
$0.315B |
|
Camtek Ltd., designs, develops, manufactures, and markets automatic optical inspection systems and related products. Camtek's automatic inspection systems are used to enhance both production processes and yield for manufacturers in the printed circuit board industry, the high density interconnect substrate industry and the semiconductor manufacturing and packaging industry.
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