Tokyo Electron Common Stock Dividends Paid 2010-2024 | TOELY
Tokyo Electron annual/quarterly common stock dividends paid history and growth rate from 2010 to 2024. Common stock dividends paid can be defined as the cash outflow for dividends paid on a company's common stock
- Tokyo Electron common stock dividends paid for the quarter ending December 31, 2024 were $0M, a 0% increase year-over-year.
- Tokyo Electron common stock dividends paid for the twelve months ending December 31, 2024 were $0M, a 0% increase year-over-year.
- Tokyo Electron annual common stock dividends paid for 2024 were $-1.337B, a 29.42% decline from 2023.
- Tokyo Electron annual common stock dividends paid for 2023 were $-1.895B, a 39.48% increase from 2022.
- Tokyo Electron annual common stock dividends paid for 2022 were $-1.358B, a 37.29% increase from 2021.
| Tokyo Electron Annual Common Stock Dividends Paid (Millions of US $) |
|
|---|---|
| 2024 | $-1,337 |
| 2023 | $-1,895 |
| 2022 | $-1,358 |
| 2021 | $-989 |
| 2020 | $-879 |
| 2019 | $-1,123 |
| 2018 | $-774 |
| 2017 | $-366 |
| 2016 | $-293 |
| 2015 | $-149 |
| 2014 | $N/A |
| 2013 | $N/A |
| 2012 | $N/A |
| 2011 | $N/A |
| 2010 | $N/A |
| 2009 | $N/A |
| Sector | Industry | Market Cap | Revenue |
|---|---|---|---|
| Computer and Technology | Electrical Products - Miscellaneous | $72.538B | $15.968B |
| Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses. | |||
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