Tokyo Electron Current Ratio 2010-2024 | TOELY
Current and historical current ratio for Tokyo Electron (TOELY) from 2010 to 2024. Current ratio can be defined as a liquidity ratio that measures a company's ability to pay short-term obligations. Tokyo Electron current ratio for the three months ending June 30, 2024 was 2.67.
| Tokyo Electron Current Ratio Historical Data |
| Date |
Current Assets |
Current Liabilities |
Current Ratio |
| 2024-06-30 |
$10.48B |
$3.93B |
2.67 |
| 2023-12-31 |
$10.46B |
$3.79B |
2.76 |
| 2023-06-30 |
$11.33B |
$4.06B |
2.79 |
| 2022-06-30 |
$10.47B |
$3.46B |
3.02 |
| 2021-06-30 |
$9.31B |
$2.76B |
3.38 |
| 2020-06-30 |
$8.75B |
$3.39B |
2.58 |
| 2019-06-30 |
$7.93B |
$2.41B |
3.29 |
| 2018-06-30 |
$8.44B |
$3.23B |
2.62 |
| 2017-06-30 |
$6.90B |
$2.12B |
3.25 |
| 2016-06-30 |
$5.10B |
$1.25B |
4.09 |
| 2015-06-30 |
$5.25B |
$1.28B |
4.12 |
| 2015-03-31 |
$5.58B |
$1.44B |
3.88 |
| 2014-12-31 |
$5.38B |
$1.37B |
3.92 |
| 2014-09-30 |
$5.44B |
$1.39B |
3.92 |
| 2014-06-30 |
$5.50B |
$1.21B |
4.55 |
| 2014-03-31 |
$6.22B |
$1.71B |
3.65 |
| 2013-12-31 |
$5.92B |
$1.64B |
3.62 |
| 2013-09-30 |
$5.49B |
$1.25B |
4.40 |
| 2013-06-30 |
$5.24B |
$1.14B |
4.59 |
| 2013-03-31 |
$6.31B |
$1.29B |
4.89 |
| 2012-12-31 |
$6.26B |
$1.21B |
5.17 |
| 2012-09-30 |
$7.00B |
$1.12B |
6.25 |
| 2012-06-30 |
$7.12B |
$1.38B |
5.16 |
| 2012-03-31 |
$7.71B |
$1.59B |
4.86 |
| 2011-12-31 |
$7.70B |
$1.64B |
4.68 |
| 2011-09-30 |
$7.87B |
$1.72B |
4.58 |
| 2011-06-30 |
$7.77B |
$1.87B |
4.16 |
| 2011-03-31 |
$7.75B |
$2.02B |
3.83 |
| 2010-12-31 |
$7.37B |
$1.81B |
4.08 |
| 2010-09-30 |
$7.05B |
$1.72B |
4.09 |
| 2010-06-30 |
$6.20B |
$1.36B |
4.55 |
| 2010-03-31 |
$5.97B |
$1.29B |
4.64 |
| 2009-12-31 |
$5.64B |
$1.15B |
4.89 |
| 2009-09-30 |
$5.19B |
$0.93B |
5.57 |
| 2009-06-30 |
$4.91B |
$0.71B |
6.92 |
| 2009-03-31 |
$5.15B |
$0.91B |
5.67 |
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Semiconductor - Discretes |
$65.499B |
$12.327B |
|
Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses.
|
