Tokyo Electron Debt to Equity Ratio 2010-2024 | TOELY

Current and historical debt to equity ratio values for Tokyo Electron (TOELY) over the last 10 years. The debt/equity ratio can be defined as a measure of a company's financial leverage calculated by dividing its long-term debt by stockholders' equity. Tokyo Electron debt/equity for the three months ending June 30, 2024 was 0.00.
Tokyo Electron Debt/Equity Ratio Historical Data
Date Long Term Debt Shareholder's Equity Debt to Equity Ratio
2024-06-30 $4.62B $11.35B 0.41
2023-12-31 $4.35B $10.73B 0.41
2023-06-30 $4.67B $11.24B 0.42
2022-06-30 $4.10B $10.12B 0.41
2021-06-30 $3.45B $9.76B 0.35
2020-06-30 $4.00B $7.89B 0.51
2019-06-30 $3.00B $7.46B 0.40
2018-06-30 $3.80B $7.11B 0.53
2017-06-30 $2.70B $5.90B 0.46
2016-06-30 $1.78B $4.78B 0.37
2015-06-30 $1.76B $5.15B 0.34
2015-03-31 $1.96B $5.34B 0.37
2014-12-31 $1.90B $5.33B 0.36
2014-09-30 $1.92B $5.40B 0.36
2014-06-30 $1.79B $5.75B 0.31
2014-03-31 $2.38B $5.91B 0.40
2013-12-31 $2.33B $5.68B 0.41
2013-09-30 $1.93B $6.14B 0.32
2013-06-30 $1.80B $6.07B 0.30
2013-03-31 $2.06B $7.32B 0.28
2012-12-31 $1.98B $7.29B 0.27
2012-09-30 $1.90B $7.57B 0.25
2012-06-30 $2.13B $7.45B 0.29
2012-03-31 $2.35B $7.60B 0.31
2011-12-31 $2.40B $7.52B 0.32
2011-09-30 $2.47B $7.63B 0.32
2011-06-30 $2.58B $7.23B 0.36
2011-03-31 $2.70B $7.03B 0.38
2010-12-31 $2.48B $6.81B 0.36
2010-09-30 $2.36B $6.44B 0.37
2010-06-30 $1.95B $5.80B 0.34
2010-03-31 $1.87B $5.65B 0.33
2009-12-31 $1.74B $5.72B 0.31
2009-09-30 $1.49B $5.51B 0.27
2009-06-30 $1.24B $5.36B 0.23
2009-03-31 $1.42B $5.39B 0.26
Sector Industry Market Cap Revenue
Computer and Technology Semiconductor - Discretes $68.411B $12.327B
Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses.
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