Tokyo Electron Long Term Debt 2010-2024 | TOELY
Tokyo Electron long term debt from 2010 to 2024. Long term debt can be defined as the sum of all long term debt fields.
- Tokyo Electron long term debt for the quarter ending June 30, 2024 was $M, a NAN% increase year-over-year.
- Tokyo Electron long term debt for 2024 was $0B, a NAN% decline from 2023.
- Tokyo Electron long term debt for 2023 was $0B, a NAN% decline from 2022.
- Tokyo Electron long term debt for 2022 was $0B, a NAN% decline from 2021.
Tokyo Electron Annual Long Term Debt
(Millions of US $) |
| 2024 |
$ |
| 2023 |
$ |
| 2022 |
$ |
| 2021 |
$ |
| 2020 |
$ |
| 2019 |
$ |
| 2018 |
$ |
| 2017 |
$ |
| 2016 |
$ |
| 2015 |
$ |
| 2014 |
$ |
| 2013 |
$ |
| 2012 |
$ |
| 2011 |
$ |
| 2010 |
$ |
| 2009 |
$ |
Tokyo Electron Quarterly Long Term Debt
(Millions of US $) |
| 2024-06-30 |
|
| 2023-06-30 |
|
| 2022-06-30 |
|
| 2021-06-30 |
|
| 2020-06-30 |
|
| 2019-06-30 |
|
| 2018-06-30 |
|
| 2017-06-30 |
|
| 2016-06-30 |
|
| 2015-06-30 |
|
| 2015-03-31 |
|
| 2014-12-31 |
|
| 2014-09-30 |
|
| 2014-06-30 |
|
| 2014-03-31 |
|
| 2013-12-31 |
|
| 2013-09-30 |
|
| 2013-06-30 |
|
| 2013-03-31 |
|
| 2012-12-31 |
|
| 2012-09-30 |
|
| 2012-06-30 |
|
| 2012-03-31 |
|
| 2011-12-31 |
|
| 2011-09-30 |
|
| 2011-06-30 |
|
| 2011-03-31 |
|
| 2010-12-31 |
|
| 2010-09-30 |
|
| 2010-06-30 |
|
| 2010-03-31 |
|
| 2009-12-31 |
|
| 2009-09-30 |
|
| 2009-06-30 |
|
| 2009-03-31 |
|
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Semiconductor - Discretes |
$65.499B |
$12.327B |
|
Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses.
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