Tokyo Electron Receivables 2010-2024 | TOELY
Tokyo Electron receivables from 2010 to 2024. Receivables can be defined as the total amount of collectibles for a company
- Tokyo Electron receivables for the quarter ending September 30, 2024 were $2.295B, a 48.72% increase year-over-year.
- Tokyo Electron receivables for 2024 were $2.583B, a 25.78% decline from 2023.
- Tokyo Electron receivables for 2023 were $3.48B, a 1.81% decline from 2022.
- Tokyo Electron receivables for 2022 were $3.544B, a 104.79% increase from 2021.
Tokyo Electron Annual Receivables
(Millions of US $) |
| 2024 |
$2,583 |
| 2023 |
$3,480 |
| 2022 |
$3,544 |
| 2021 |
$1,731 |
| 2020 |
$1,380 |
| 2019 |
$1,322 |
| 2018 |
$1,501 |
| 2017 |
$1,244 |
| 2016 |
$1,034 |
| 2015 |
$919 |
| 2014 |
$ |
| 2013 |
$ |
| 2012 |
$ |
| 2011 |
$ |
| 2010 |
$ |
| 2009 |
$ |
Tokyo Electron Quarterly Receivables
(Millions of US $) |
| 2024-06-30 |
$2,295 |
| 2023-06-30 |
$2,691 |
| 2022-06-30 |
$3,280 |
| 2021-06-30 |
$2,311 |
| 2020-06-30 |
$1,543 |
| 2019-06-30 |
$876 |
| 2018-06-30 |
$1,392 |
| 2017-06-30 |
$1,257 |
| 2016-06-30 |
$893 |
| 2015-06-30 |
$803 |
| 2015-03-31 |
$919 |
| 2014-12-31 |
|
| 2014-09-30 |
|
| 2014-06-30 |
|
| 2014-03-31 |
|
| 2013-12-31 |
|
| 2013-09-30 |
|
| 2013-06-30 |
|
| 2013-03-31 |
|
| 2012-12-31 |
|
| 2012-09-30 |
|
| 2012-06-30 |
|
| 2012-03-31 |
|
| 2011-12-31 |
|
| 2011-09-30 |
|
| 2011-06-30 |
|
| 2011-03-31 |
|
| 2010-12-31 |
|
| 2010-09-30 |
|
| 2010-06-30 |
|
| 2010-03-31 |
|
| 2009-12-31 |
|
| 2009-09-30 |
|
| 2009-06-30 |
|
| 2009-03-31 |
|
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Semiconductor - Discretes |
$68.411B |
$12.327B |
|
Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses.
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