Tokyo Electron Pre-Paid Expenses 2010-2024 | TOELY
Tokyo Electron pre-paid expenses from 2010 to 2024. Pre-paid expenses can be defined as a current asset created by prepayment of costs and expenses for which the benefits will occur at a future date.
- Tokyo Electron pre-paid expenses for the quarter ending June 30, 2024 were $M, a 100% decline year-over-year.
- Tokyo Electron pre-paid expenses for 2024 were $0.238B, a 74.32% decline from 2023.
- Tokyo Electron pre-paid expenses for 2023 were $0.928B, a 2.84% increase from 2022.
- Tokyo Electron pre-paid expenses for 2022 were $0.903B, a 20.85% increase from 2021.
Tokyo Electron Annual Pre-Paid Expenses
(Millions of US $) |
| 2024 |
$238 |
| 2023 |
$928 |
| 2022 |
$903 |
| 2021 |
$747 |
| 2020 |
$119 |
| 2019 |
$802 |
| 2018 |
$651 |
| 2017 |
$499 |
| 2016 |
$337 |
| 2015 |
$327 |
| 2014 |
$ |
| 2013 |
$ |
| 2012 |
$ |
| 2011 |
$ |
| 2010 |
$ |
| 2009 |
$ |
Tokyo Electron Quarterly Pre-Paid Expenses
(Millions of US $) |
| 2024-06-30 |
|
| 2023-06-30 |
$476 |
| 2022-06-30 |
$479 |
| 2021-06-30 |
$365 |
| 2020-06-30 |
$351 |
| 2019-06-30 |
$483 |
| 2018-06-30 |
$265 |
| 2017-06-30 |
$587 |
| 2016-06-30 |
$429 |
| 2015-06-30 |
$399 |
| 2015-03-31 |
|
| 2014-12-31 |
|
| 2014-09-30 |
|
| 2014-06-30 |
|
| 2014-03-31 |
|
| 2013-12-31 |
|
| 2013-09-30 |
|
| 2013-06-30 |
|
| 2013-03-31 |
|
| 2012-12-31 |
|
| 2012-09-30 |
|
| 2012-06-30 |
|
| 2012-03-31 |
|
| 2011-12-31 |
|
| 2011-09-30 |
|
| 2011-06-30 |
|
| 2011-03-31 |
|
| 2010-12-31 |
|
| 2010-09-30 |
|
| 2010-06-30 |
|
| 2010-03-31 |
|
| 2009-12-31 |
|
| 2009-09-30 |
|
| 2009-06-30 |
|
| 2009-03-31 |
|
| Sector |
Industry |
Market Cap |
Revenue |
| Computer and Technology |
Semiconductor - Discretes |
$73.823B |
$12.327B |
|
Tokyo Electron Limited (TEL) is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The Semiconductor Manufacturing Equipment segment is engaged in the provision of coaters and developers for wafer processing, plasma etching equipment, thermal processing systems and others. The Flat-panel Display (FPD) Manufacturing Equipment segment is engaged in the provision of coaters and developers for FPD manufacturing, plasma etching/ashing apparatus and others. The Electronic Component and Information Communication Equipment segment provides semiconductor products such as integrated circuits (ICs), computer and network equipment and software. In addition, the Company is also involved in logistics, facility management and insurance businesses.
|
